TSE2002GB2A1NCG

Renesas Electronics America Inc TSE2002GB2A1NCG

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  • TSE2002GB2A1NCG
  • Renesas Electronics America Inc
  • IC TEMP SENS EEPROM DFN-8
  • PMIC - Thermal Management
  • TSE2002GB2A1NCG Datasheet
  • 8-WFDFN Exposed Pad
  • Tape & Reel (TR)
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 3015
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
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What is TSE2002GB2A1NCG

Renesas Electronics America Inc Part Number TSE2002GB2A1NCG（PMIC - Thermal Management）, developed and manufactured by Renesas Electronics America Inc, distributed globally by Jinftry. We distribute various electronic components from world-renowned brands and provide one-stop services, making us a trusted global electronic component distributor.

TSE2002GB2A1NCG is one of the part numbers distributed by Jinftry, and you can learn about its specifications/configurations, package/case, Datasheet, and other information here. Electronic components are affected by supply and demand, and prices fluctuate frequently. If you have a demand, please do not hesitate to send us an RFQ or email us immediately [email protected] Please inquire about the real-time unit price, Data Code, Lead time, payment terms, and any other information you would like to know. We will do our best to provide you with a quotation and reply as soon as possible.

TSE2002GB2A1NCG Specifications

  • Part NumberTSE2002GB2A1NCG
  • CategoryPMIC - Thermal Management
  • ManufacturerRenesas Electronics America Inc
  • DescriptionIC TEMP SENS EEPROM DFN-8
  • PackageTape & Reel (TR)
  • Series-
  • Voltage - Supply2.3V ~ 3.6V
  • Operating Temperature-20°C ~ 125°C
  • Mounting TypeSurface Mount
  • Package / Case8-WFDFN Exposed Pad
  • Supplier Device Package8-VFQFPN (2x3)
  • FunctionTemp Monitoring System (Sensor)
  • Sensor TypeInternal
  • Accuracy±2°C
  • TopologyADC, Register Bank
  • Output TypeI²C/SMBus
  • Output AlarmNo
  • Output FanNo
  • Sensing Temperature-20°C ~ 125°C

Application of TSE2002GB2A1NCG

PMIC- Thermal Management P is used in a wide range of applications, covering almost all electronic devices that require efficient heat dissipation and temperature control. In consumer electronics such as smartphones and tablets, as processor performance continues to improve and screen brightness increases, thermal management becomes key to ensuring the user experience. In the field of automotive electronics, in the face of high load operation under extreme weather conditions and complex road conditions, PMIC thermal management ensures the stable operation of on-board electronic systems such as engine control units and infotainment systems. In addition, in industrial and commercial areas such as data center servers and high-performance computing clusters, efficient thermal management technologies are essential to maintain the continuous and efficient operation of equipment in high-density deployments.

TSE2002GB2A1NCG Datasheet

TSE2002GB2A1NCG Datasheet , Tape & Reel (TR),2.3V ~ 3.6V,-20°C ~ 125°C,Surface Mount,8-WFDFN Exposed Pad,8-VFQFPN (2x3),Temp Monitoring System (Sensor),Internal,±2°C,ADC, Register Bank,I²C/SMBus,No,No,-20°C ~ 125°C

TSE2002GB2A1NCG Classification

PMIC - Thermal Management

PMIC-Thermal Management refers to the Integrated Power Management Integrated Circuit (PMIC-Thermal management) for monitoring and controlling the internal temperature of electronic devices. It can monitor the temperature of the components inside the device in real time and adjust the power supply strategy as needed to avoid overheating. PMIC- Thermal management reduces heat generation by intelligently regulating parameters such as current and voltage, ensuring that equipment operates within a safe temperature range, thereby improving equipment reliability and service life.

FAQ about PMIC - Thermal Management

  • 1. Why is thermal management essential in PMICs?

    Proper thermal management ensures efficient performance, prevents overheating, and extends the lifespan of both the PMIC and the device it powers.

  • 2. How do PMICs dissipate heat?

    PMICs use heat-sinking techniques, optimized PCB layouts, and component placements to improve heat dissipation and prevent hot spots.

  • 3. What factors affect the thermal performance of a PMIC?

    Thermal performance is influenced by power density, component placement, cooling methods, and the PMIC’s proximity to other heat-generating components.

We are a professional PCB manufacturer who offers comprehensive PCB manufacturing services including: professional Ceramic PCB HDI PCB Heavy Copper PCB High-TG PCB High Speed PCB High Frequency PCB Metal Core PCB PCB fabrication and PCB assembly, providing fast turnaround prototypes for high-end products.

• Prompt Responsiveness

• Guaranteed Quality

• Global Access

• Competitive Market Price

• One-Stop support services of supply chain

Jinftry, Your most trustworthy component supplier, welcome to send us the inquiry, thank you!

Do you have any questions about TSE2002GB2A1NCG ?
Feel free to contact us:

+86-755-28503874
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Email first will be appreciative )

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Renesas Electronics America Inc
Renesas Electronics America Inc
Renesas Electronics America Inc. is a semiconductor manufacturing company that specializes in designing, manufacturing, and selling embedded semiconductor solutions. Renesas Electronics America Inc. is the subsidiary of Renesas Electronics Corporation in the United...
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