BYT08P-400 vs BAS70WFILM

Part Number
BYT08P-400
BAS70WFILM
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer STMicroelectronics STMicroelectronics
Description DIODE GEN PURP 400V 8A TO220AC DIODE SCHOTTKY 70V 70MA SOT323
Package Tube Tape & Reel (TR)
Series - -
Mounting Type Through Hole Surface Mount
Package / Case TO-220-2 SC-70, SOT-323
Supplier Device Package TO-220AC SOT-323
Diode Type Standard Schottky
Current - Average Rectified (Io) 8A 70mA (DC)
Voltage - Forward (Vf) (Max) @ If 1.5 V @ 8 A 1 V @ 15 mA
Current - Reverse Leakage @ Vr 15 µA @ 400 V 10 µA @ 70 V
Capacitance @ Vr, F - 2pF @ 0V, 1MHz
Voltage - DC Reverse (Vr) (Max) 400 V 70 V
Speed Fast Recovery =< 500ns, > 200mA (Io) Small Signal =< 200mA (Io), Any Speed
Reverse Recovery Time (trr) 75 ns -
Operating Temperature - Junction 150°C (Max) 150°C (Max)
  • 1. What is forward voltage drop?

    Forward voltage drop refers to the voltage drop generated when the current passes through a diode when it is conducting. The forward voltage drop of silicon rectifier diodes is usually around 0.7V, while the forward voltage drop of Schottky diodes is usually lower, between 0.2V and 0.3V.

  • 2. What is the difference between a single rectifier diode and a bridge rectifier?

    A single rectifier diode can only rectify the positive half wave of AC power (half wave rectification), while a bridge rectifier composed of four diodes can rectify the positive and negative half waves of AC power (full wave rectification), with higher efficiency and smoother output.

  • 3. What is the difference between Schottky diodes and traditional silicon rectifier diodes?

    Schottky diodes have a lower forward voltage drop (typically 0.2V to 0.3V) and faster switching speed, making them suitable for high-frequency applications. However, their reverse voltage is relatively low and is typically used in circuits with lower voltages.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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