SDM2A20CSP-7 vs 1N5822-E3/54
| Part Number |
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| Category | Diodes - Rectifiers - Single | Diodes - Rectifiers - Single |
| Manufacturer | Diodes Incorporated | Vishay Semiconductor - Diodes Division |
| Description | DIODE SCHTKY 20V 2A X3-WLB1406-2 | DIODE SCHOTTKY 40V 3A DO201AD |
| Package | -Reel® | -Reel® |
| Series | - | - |
| Mounting Type | Surface Mount | Through Hole |
| Package / Case | 2-XDFN | DO-201AD, Axial |
| Supplier Device Package | X3-WLB1406-2 | DO-201AD |
| Diode Type | Schottky | Schottky |
| Current - Average Rectified (Io) | 2A | 3A |
| Voltage - Forward (Vf) (Max) @ If | 530 mV @ 2 A | 525 mV @ 3 A |
| Current - Reverse Leakage @ Vr | 80 µA @ 20 V | 2 mA @ 40 V |
| Capacitance @ Vr, F | 70pF @ 5V, 1MHz | - |
| Voltage - DC Reverse (Vr) (Max) | 20 V | 40 V |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | - | - |
| Operating Temperature - Junction | -55°C ~ 150°C | -65°C ~ 125°C |
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1. What is the maximum reverse voltage (PIV) of a rectifier diode?
The Peak Inverse Voltage (PIV) is the maximum reverse voltage that a diode can withstand. When selecting a diode, the PIV must be higher than the maximum reverse voltage in the circuit, usually twice or more the input voltage.
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2. What is the difference between Schottky diodes and traditional silicon rectifier diodes?
Schottky diodes have a lower forward voltage drop (typically 0.2V to 0.3V) and faster switching speed, making them suitable for high-frequency applications. However, their reverse voltage is relatively low and is typically used in circuits with lower voltages.
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3. What is the reverse recovery time of a rectifier diode?
Reverse recovery time refers to the time required for a diode to transition from a forward conducting state to a reverse blocking state. A shorter reverse recovery time is particularly important in high-frequency applications to reduce power loss.
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4. What are the packaging types of rectifier diodes?
There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.
