SFS1001GHMNG vs SRAS840HMNG

Part Number
SFS1001GHMNG
SRAS840HMNG
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer Taiwan Semiconductor Corporation Taiwan Semiconductor Corporation
Description DIODE GEN PURP 50V 10A TO263AB DIODE SCHOTTKY 40V 8A TO263AB
Package Tape & Reel (TR) Tape & Reel (TR)
Series Automotive, AEC-Q101 Automotive, AEC-Q101
Mounting Type Surface Mount Surface Mount
Package / Case TO-263-3, D²Pak (2 Leads + Tab), TO-263AB TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Supplier Device Package TO-263AB (D²PAK) TO-263AB (D²PAK)
Diode Type Standard Schottky
Current - Average Rectified (Io) 10A 8A
Voltage - Forward (Vf) (Max) @ If 975 mV @ 5 A 550 mV @ 8 A
Current - Reverse Leakage @ Vr 1 µA @ 50 V 100 µA @ 40 V
Capacitance @ Vr, F 70pF @ 4V, 1MHz -
Voltage - DC Reverse (Vr) (Max) 50 V 40 V
Speed Fast Recovery =< 500ns, > 200mA (Io) Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr) 35 ns -
Operating Temperature - Junction -55°C ~ 150°C -55°C ~ 125°C
  • 1. What are the common applications of a single rectifier diode?

    They are commonly used in power circuits, chargers, AC to DC converters, motor drives, circuit protection, and other electronic devices to convert AC power to DC power or protect circuits from reverse current.

  • 2. What is the maximum reverse voltage (PIV) of a rectifier diode?

    The Peak Inverse Voltage (PIV) is the maximum reverse voltage that a diode can withstand. When selecting a diode, the PIV must be higher than the maximum reverse voltage in the circuit, usually twice or more the input voltage.

  • 3. What is a fast recovery diode?

    Fast recovery diode is a special type of rectifier diode with a short reverse recovery time, suitable for high-frequency power supplies and switch mode power supplies (SMPS) applications, reducing switching losses.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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