SK55C R7 vs SK86C M6

Part Number
SK55C R7
SK86C M6
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer Taiwan Semiconductor Corporation Taiwan Semiconductor Corporation
Description DIODE SCHOTTKY DO214AB DIODE SCHOTTKY DO214AB
Package Tape & Reel (TR) Tape & Reel (TR)
Series - -
Mounting Type Surface Mount Surface Mount
Package / Case DO-214AB, SMC DO-214AB, SMC
Supplier Device Package DO-214AB (SMC) DO-214AB (SMC)
Diode Type Schottky Schottky
Current - Average Rectified (Io) 5A 8A (DC)
Voltage - Forward (Vf) (Max) @ If 750 mV @ 5 A 750 mV @ 8 A
Current - Reverse Leakage @ Vr 500 µA @ 50 V 500 µA @ 60 V
Capacitance @ Vr, F - -
Voltage - DC Reverse (Vr) (Max) 50 V 60 V
Speed Fast Recovery =< 500ns, > 200mA (Io) Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr) - -
Operating Temperature - Junction -55°C ~ 150°C -55°C ~ 150°C
  • 1. What are the common applications of a single rectifier diode?

    They are commonly used in power circuits, chargers, AC to DC converters, motor drives, circuit protection, and other electronic devices to convert AC power to DC power or protect circuits from reverse current.

  • 2. What is forward voltage drop?

    Forward voltage drop refers to the voltage drop generated when the current passes through a diode when it is conducting. The forward voltage drop of silicon rectifier diodes is usually around 0.7V, while the forward voltage drop of Schottky diodes is usually lower, between 0.2V and 0.3V.

  • 3. How to improve the efficiency of rectifier diodes?

    The use of Schottky diodes or fast recovery diodes can reduce forward voltage drop and reverse recovery time, thereby improving the efficiency of rectifier circuits, especially in high-frequency applications.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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