STPSC8H065G-TR vs FFH50US60S_F085

Part Number
STPSC8H065G-TR
FFH50US60S_F085
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer STMicroelectronics Fairchild Semiconductor
Description DIODE SCHOTTKY 650V 8A D2PAK DIODE STEALTH 600V 50A TO247
Package -Reel® TO-247-2
Series - Automotive, AEC-Q101, Stealth?
Mounting Type Surface Mount Through Hole
Package / Case TO-263-3, D²Pak (2 Leads + Tab), TO-263AB TO-247-2
Supplier Device Package D²PAK TO-247-2
Diode Type Silicon Carbide Schottky Standard
Current - Average Rectified (Io) 8A 50A
Voltage - Forward (Vf) (Max) @ If 1.75 V @ 8 A 1.69V @ 50A
Current - Reverse Leakage @ Vr 80 µA @ 650 V 100µA @ 600V
Capacitance @ Vr, F 414pF @ 0V, 1MHz -
Voltage - DC Reverse (Vr) (Max) 650 V 600V
Speed No Recovery Time > 500mA (Io) Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr) 0 ns 163ns
Operating Temperature - Junction -40°C ~ 175°C -55°C ~ 175°C
  • 1. What is the maximum reverse voltage (PIV) of a rectifier diode?

    The Peak Inverse Voltage (PIV) is the maximum reverse voltage that a diode can withstand. When selecting a diode, the PIV must be higher than the maximum reverse voltage in the circuit, usually twice or more the input voltage.

  • 2. What is the difference between Schottky diodes and traditional silicon rectifier diodes?

    Schottky diodes have a lower forward voltage drop (typically 0.2V to 0.3V) and faster switching speed, making them suitable for high-frequency applications. However, their reverse voltage is relatively low and is typically used in circuits with lower voltages.

  • 3. How to improve the efficiency of rectifier diodes?

    The use of Schottky diodes or fast recovery diodes can reduce forward voltage drop and reverse recovery time, thereby improving the efficiency of rectifier circuits, especially in high-frequency applications.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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