STPSC8H065G-TR vs RHRG3060_F085

Part Number
STPSC8H065G-TR
RHRG3060_F085
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer STMicroelectronics Fairchild Semiconductor
Description DIODE SCHOTTKY 650V 8A D2PAK DIODE GEN PURP 600V 30A TO247-2
Package -Reel® TO-247-2
Series - Automotive, AEC-Q101
Mounting Type Surface Mount Through Hole
Package / Case TO-263-3, D²Pak (2 Leads + Tab), TO-263AB TO-247-2
Supplier Device Package D²PAK TO-247-2
Diode Type Silicon Carbide Schottky Standard
Current - Average Rectified (Io) 8A 30A
Voltage - Forward (Vf) (Max) @ If 1.75 V @ 8 A 2.1V @ 30A
Current - Reverse Leakage @ Vr 80 µA @ 650 V 250µA @ 600V
Capacitance @ Vr, F 414pF @ 0V, 1MHz -
Voltage - DC Reverse (Vr) (Max) 650 V 600V
Speed No Recovery Time > 500mA (Io) Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr) 0 ns 45ns
Operating Temperature - Junction -40°C ~ 175°C -55°C ~ 175°C
  • 1. What is a single rectifier diode?

    A single rectifier diode is an electronic component used to convert alternating current (AC) to direct current (DC), typically used in power supplies, chargers, and other circuits that require DC power.

  • 2. What is the difference between a single rectifier diode and a bridge rectifier?

    A single rectifier diode can only rectify the positive half wave of AC power (half wave rectification), while a bridge rectifier composed of four diodes can rectify the positive and negative half waves of AC power (full wave rectification), with higher efficiency and smoother output.

  • 3. Can a single rectifier diode be used for high-frequency applications?

    Traditional silicon rectifier diodes are not suitable for high-frequency applications because their reverse recovery time is relatively long. For high-frequency applications, fast recovery diodes or Schottky diodes are typically used to reduce switching losses and improve efficiency.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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