W632GU6MB-12 vs AT28C256F-15SU-T

Part Number
W632GU6MB-12
AT28C256F-15SU-T
Category General Memory General Memory
Manufacturer Winbond Electronics Microchip Technology
Description IC DRAM 2GBIT PARALLEL 96VFBGA IC EEPROM 256KBIT PAR 28SOIC
Package Tray Tape & Reel (TR)
Series - -
Voltage - Supply 1.283V ~ 1.45V 4.5V ~ 5.5V
Operating Temperature 0°C ~ 95°C (TC) -40°C ~ 85°C (TC)
Mounting Type Surface Mount Surface Mount
Package / Case 96-VFBGA 28-SOIC (0.295\", 7.50mm Width)
Supplier Device Package 96-VFBGA (7.5x13) 28-SOIC
Memory Size 2Gb (128M x 16) 256Kb (32K x 8)
Technology SDRAM - DDR3 EEPROM
Memory Type Volatile Non-Volatile
Clock Frequency 800 MHz -
Access Time 20 ns 150 ns
Memory Format DRAM EEPROM
Write Cycle Time - Word, Page - 3ms
Memory Interface Parallel Parallel
  • 1. What is SSD and how to distinguish it from HDD?

    SSD (Solid State Drive) is a non-volatile storage device that stores data through flash memory. It has faster read and write speeds than HDD (Hard Disk Drive), no mechanical structure, and long life, but the price is relatively higher.

  • 2. What is embedded memory?

    Embedded memory is a memory integrated into an electronic system for real-time data processing and program execution of the device. It is commonly found in microcontrollers, mobile devices, and embedded systems.

  • 3. How to extend the life of memory devices?

    Measures such as regular data backup, avoiding excessive reading and writing of memory, ensuring proper temperature control, and preventing power fluctuations can help extend the life of memory.

  • 4. What is High Bandwidth Memory (HBM) and what are its advantages?

    HBM is a high-bandwidth, low-latency memory technology commonly used in graphics cards and AI accelerators that can handle a large number of parallel computing tasks. HBM's stacked architecture makes it take up less space and more efficient, making it an ideal choice for big data and high-performance computing applications.

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