SS22/1 vs U3B-M3/57T
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| Category | Diodes - Rectifiers - Single | Diodes - Rectifiers - Single |
| Manufacturer | Vishay Semiconductor - Diodes Division | Vishay Semiconductor - Diodes Division |
| Description | DIODE SCHOTTKY 20V 2A DO214AA | DIODE GEN PURP 100V 2A DO214AB |
| Package | Bulk | Tape & Reel (TR) |
| Series | - | - |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | DO-214AA, SMB | DO-214AB, SMC |
| Supplier Device Package | DO-214AA (SMB) | DO-214AB (SMC) |
| Diode Type | Schottky | Standard |
| Current - Average Rectified (Io) | 2A | 2A |
| Voltage - Forward (Vf) (Max) @ If | 500 mV @ 2 A | 900 mV @ 3 A |
| Current - Reverse Leakage @ Vr | 400 µA @ 20 V | 10 µA @ 100 V |
| Capacitance @ Vr, F | - | 25pF @ 4V, 1MHz |
| Voltage - DC Reverse (Vr) (Max) | 20 V | 100 V |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | - | 30 ns |
| Operating Temperature - Junction | -65°C ~ 125°C | -55°C ~ 150°C |
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1. What is a single rectifier diode?
A single rectifier diode is an electronic component used to convert alternating current (AC) to direct current (DC), typically used in power supplies, chargers, and other circuits that require DC power.
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2. What is forward voltage drop?
Forward voltage drop refers to the voltage drop generated when the current passes through a diode when it is conducting. The forward voltage drop of silicon rectifier diodes is usually around 0.7V, while the forward voltage drop of Schottky diodes is usually lower, between 0.2V and 0.3V.
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3. What is the difference between a single rectifier diode and a bridge rectifier?
A single rectifier diode can only rectify the positive half wave of AC power (half wave rectification), while a bridge rectifier composed of four diodes can rectify the positive and negative half waves of AC power (full wave rectification), with higher efficiency and smoother output.
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4. What are the packaging types of rectifier diodes?
There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.
