Samtec Inc. EHF-117-01-SM-D-RA
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- EHF-117-01-SM-D-RA
- Samtec Inc.
- .050 EJECTOR HEADER ASSEMBLY
- Rectangular Connectors - Headers, Male Pins
- EHF-117-01-SM-D-RA Datasheet
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Lead free / RoHS Compliant - 3152
- Spot Inventory / Athorized Dstributor / Factory Excess Stock
- 1 year quality assurance 》
- Click to get rates
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| Part Number EHF-117-01-SM-D-RA |
| Category Rectangular Connectors - Headers, Male Pins |
| Manufacturer Samtec Inc. |
| Description .050 EJECTOR HEADER ASSEMBLY |
| Package - |
| Series EHF |
| Features Keying Slot |
| Operating Temperature -55°C ~ 125°C |
| Mounting Type Through Hole, Right Angle |
| Termination Solder |
| Style Board to Cable/Wire |
| Current Rating 1.75A |
| Contact Material Phosphor Bronze |
| Number of Positions 34 |
| Connector Type Header |
| Number of Positions Loaded All |
| Number of Rows 2 |
| Insulation Color Black |
| Contact Type Male Pin |
| Fastening Type Latch Lock/Eject Hooks |
| Pitch - Mating 0.050" (1.27mm) |
| Shrouding Shrouded - 4 Wall |
| Contact Length - Mating 0.120" (3.05mm) |
| Contact Length - Post 0.090" (2.29mm) |
| Insulation Height 0.263" (6.67mm) |
| Contact Shape Square |
| Contact Finish - Mating Gold |
| Contact Finish - Post Tin |
| Insulation Material Liquid Crystal Polymer (LCP), Glass Filled |
| Contact Finish Thickness - Mating 30µin (0.76µm) |
| Row Spacing - Mating 0.050" (1.27mm) |
| Package_case - |
EHF-117-01-SM-D-RA Guarantees
• Prompt Responsiveness
• Guaranteed Quality
• Global Access
• Competitive Market Price
• One-Stop support services of supply chain
Jinftry, Your most trustworthy component supplier, welcome to send us the inquiry, thank you!
Do you have any questions about EHF-117-01-SM-D-RA ?
Feel free to contact us:
+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Email first will be appreciative )
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Customer reviews
Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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