EJH-125-01-F-D-SM-17

Samtec Inc. EJH-125-01-F-D-SM-17

The picture is for reference only, please refer to the product specification

  • EJH-125-01-F-D-SM-17
  • Samtec Inc.
  • .100 X .100 EJECTOR HEADER ASSEM
  • Rectangular Connectors - Headers, Male Pins
  • EJH-125-01-F-D-SM-17 Datasheet
  • -
  • -
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 21632
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
EJH-125-01-F-D-SM-17
Category
Rectangular Connectors - Headers, Male Pins
Manufacturer
Samtec Inc.
Description
.100 X .100 EJECTOR HEADER ASSEM
Package
-
Series
EJH
Features
Keying Slot
Operating Temperature
-55°C ~ 125°C
Mounting Type
Surface Mount
Termination
Solder
Style
Board to Cable/Wire
Current Rating
3A
Contact Material
Phosphor Bronze
Number of Positions
50
Connector Type
Header
Number of Positions Loaded
49
Number of Rows
2
Insulation Color
Black
Contact Type
Male Pin
Fastening Type
Latch Lock/Eject Hooks
Pitch - Mating
0.100" (2.54mm)
Shrouding
Shrouded - 4 Wall
Contact Length - Mating
0.225" (5.72mm)
Insulation Height
0.500" (12.70mm)
Contact Shape
Square
Contact Finish - Mating
Gold
Contact Finish - Post
Tin
Insulation Material
Liquid Crystal Polymer (LCP)
Contact Finish Thickness - Mating
3µin (0.08µm)
Row Spacing - Mating
0.100" (2.54mm)
Package_case
-

EJH-125-01-F-D-SM-17 Guarantees

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• Prompt Responsiveness

• Guaranteed Quality

• Global Access

• Competitive Market Price

• One-Stop support services of supply chain

Jinftry, Your most trustworthy component supplier, welcome to send us the inquiry, thank you!

Do you have any questions about EJH-125-01-F-D-SM-17 ?
Feel free to contact us:

+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Email first will be appreciative )

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Samtec Inc.
Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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