EPC EPC2010CENGR
- EPC2010CENGR
- EPC
- TRANS GAN 200V 22A BUMPED DIE
- Transistors - FETs, MOSFETs - Single
- EPC2010CENGR Datasheet
- Die
- Die
- Lead free / RoHS Compliant
- 2014
- Spot Inventory / Athorized Dstributor / Factory Excess Stock
- 1 year quality assurance 》
- Click to get rates
Part Number EPC2010CENGR |
Category Transistors - FETs, MOSFETs - Single |
Manufacturer EPC |
Description TRANS GAN 200V 22A BUMPED DIE |
Package Die |
Series eGaN? |
Operating Temperature -40°C ~ 150°C (TJ) |
Mounting Type Surface Mount |
Package / Case Die |
Supplier Device Package Die Outline (7-Solder Bar) |
Technology GaNFET (Gallium Nitride) |
FET Type N-Channel |
Drain to Source Voltage (Vdss) 200V |
Current - Continuous Drain (Id) @ 25°C 22A (Ta) |
Rds On (Max) @ Id, Vgs 25 mOhm @ 12A, 5V |
Vgs(th) (Max) @ Id 2.5V @ 3mA |
Gate Charge (Qg) (Max) @ Vgs 3.7nC @ 5V |
Input Capacitance (Ciss) (Max) @ Vds 380pF @ 100V |
Drive Voltage (Max Rds On, Min Rds On) 5V |
Vgs (Max) +6V, -4V |
Package_case Die |
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