FWJ-01-01-T-S

Samtec Inc. FWJ-01-01-T-S

The picture is for reference only, please refer to the product specification

  • FWJ-01-01-T-S
  • Samtec Inc.
  • CONN HEADER .156" 1POS SNGL TIN
  • Rectangular Connectors - Headers, Male Pins
  • FWJ-01-01-T-S Datasheet
  • -
  • -
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 4155
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
FWJ-01-01-T-S
Category
Rectangular Connectors - Headers, Male Pins
Manufacturer
Samtec Inc.
Description
CONN HEADER .156" 1POS SNGL TIN
Package
-
Series
FWJ
Operating Temperature
-55°C ~ 105°C
Mounting Type
Through Hole
Termination
Solder
Style
Board to Board
Current Rating
6.7A per contact
Contact Material
Phosphor Bronze
Number of Positions
1
Connector Type
Header
Number of Positions Loaded
All
Number of Rows
1
Insulation Color
Black
Contact Type
Male Pin
Fastening Type
Push-Pull
Material Flammability Rating
UL94 V-0
Shrouding
Unshrouded
Contact Length - Mating
0.450" (11.43mm)
Contact Length - Post
0.175" (4.45mm)
Insulation Height
0.125" (3.18mm)
Contact Shape
Square
Contact Finish - Mating
Tin
Contact Finish - Post
Tin
Insulation Material
Polybutylene Terephthalate (PBT)
Overall Contact Length
0.750" (19.05mm)
Package_case
-

FWJ-01-01-T-S Guarantees

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• Prompt Responsiveness

• Guaranteed Quality

• Global Access

• Competitive Market Price

• One-Stop support services of supply chain

Jinftry, Your most trustworthy component supplier, welcome to send us the inquiry, thank you!

Do you have any questions about FWJ-01-01-T-S ?
Feel free to contact us:

+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Email first will be appreciative )

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Samtec Inc.
Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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