LPC2364FET100,518

NXP USA Inc. LPC2364FET100,518

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  • LPC2364FET100,518
  • NXP USA Inc.
  • IC MCU 16/32BIT 128KB 100TFBGA
  • Embedded - Microcontrollers
  • LPC2364FET100,518 Datasheet
  • 100-TFBGA
  • Tray
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 1392
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
LPC2364FET100,518
Category
Embedded - Microcontrollers
Manufacturer
NXP USA Inc.
Description
IC MCU 16/32BIT 128KB 100TFBGA
Package
Tray
Series
LPC2300
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
100-TFBGA
Supplier Device Package
100-TFBGA (9x9)
Voltage - Supply (Vcc/Vdd)
3V ~ 3.6V
Speed
72MHz
Number of I/O
70
EEPROM Size
-
Core Processor
ARM7®
RAM Size
34K x 8
Core Size
16/32-Bit
Connectivity
CANbus, Ethernet, I²C, Microwire, SPI, SSI, SSP, UART/USART, USB
Peripherals
Brown-out Detect/Reset, DMA, I²S, POR, PWM, WDT
Program Memory Size
128KB (128K x 8)
Program Memory Type
FLASH
Data Converters
A/D 6x10b; D/A 1x10b
Oscillator Type
Internal
Package_case
100-TFBGA

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NXP USA Inc.
NXP USA Inc.
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is ...
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