LPC2930FBD208,551

NXP USA Inc. LPC2930FBD208,551

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  • LPC2930FBD208,551
  • NXP USA Inc.
  • IC MCU 16/32BIT ROMLESS 208LQFP
  • Embedded - Microcontrollers
  • LPC2930FBD208,551 Datasheet
  • 208-LQFP
  • Tray
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 23002
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
LPC2930FBD208,551
Category
Embedded - Microcontrollers
Manufacturer
NXP USA Inc.
Description
IC MCU 16/32BIT ROMLESS 208LQFP
Package
Tray
Series
LPC2900
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
208-LQFP
Supplier Device Package
208-LQFP (28x28)
Voltage - Supply (Vcc/Vdd)
1.71V ~ 3.6V
Speed
125MHz
Number of I/O
152
EEPROM Size
-
Core Processor
ARM968E-S
RAM Size
56K x 8
Core Size
16/32-Bit
Connectivity
CANbus, EBI/EMI, I²C, LINbus, SPI, UART/USART, USB, USB OTG
Peripherals
DMA, POR, PWM, WDT
Program Memory Size
-
Program Memory Type
ROMless
Data Converters
A/D 24x10b
Oscillator Type
Internal
Package_case
208-LQFP

LPC2930FBD208,551 Guarantees

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568248857, 827259012, 316249462
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NXP USA Inc.
NXP USA Inc.
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is ...
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