LPC3130FET180,551

NXP USA Inc. LPC3130FET180,551

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  • LPC3130FET180,551
  • NXP USA Inc.
  • IC MCU 16/32BIT ROMLESS 180TFBGA
  • Embedded - Microcontrollers
  • LPC3130FET180,551 Datasheet
  • 180-TFBGA
  • Tray
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 1308
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
LPC3130FET180,551
Category
Embedded - Microcontrollers
Manufacturer
NXP USA Inc.
Description
IC MCU 16/32BIT ROMLESS 180TFBGA
Package
Tray
Series
LPC3100
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
180-TFBGA
Supplier Device Package
180-TFBGA (12x12)
Voltage - Supply (Vcc/Vdd)
1.1V ~ 3.6V
Speed
180MHz
Number of I/O
-
EEPROM Size
-
Core Processor
ARM926EJ-S
RAM Size
96K x 8
Core Size
16/32-Bit
Connectivity
EBI/EMI, I²C, Memory Card, SPI, UART/USART, USB OTG
Peripherals
DMA, I²S, LCD, PWM, WDT
Program Memory Size
-
Program Memory Type
ROMless
Data Converters
A/D 4x10b
Oscillator Type
External
Package_case
180-TFBGA

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NXP USA Inc.
NXP USA Inc.
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is ...
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