MCF54452CVR200

NXP USA Inc. MCF54452CVR200

The picture is for reference only, please refer to the product specification

  • MCF54452CVR200
  • NXP USA Inc.
  • IC MCU 32BIT ROMLESS 360TEPBGA
  • Embedded - Microcontrollers
  • MCF54452CVR200 Datasheet
  • 360-BBGA
  • Tray
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 25539
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
MCF54452CVR200
Category
Embedded - Microcontrollers
Manufacturer
NXP USA Inc.
Description
IC MCU 32BIT ROMLESS 360TEPBGA
Package
Tray
Series
MCF5445x
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
360-BBGA
Supplier Device Package
360-TEPBGA (23x23)
Voltage - Supply (Vcc/Vdd)
1.35V ~ 3.6V
Speed
200MHz
Number of I/O
132
EEPROM Size
-
Core Processor
Coldfire V4
RAM Size
32K x 8
Core Size
32-Bit
Connectivity
I²C, SPI, SSI, UART/USART, USB OTG
Peripherals
DMA, WDT
Program Memory Size
-
Program Memory Type
ROMless
Data Converters
-
Oscillator Type
Internal
Package_case
360-BBGA

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NXP USA Inc.
NXP USA Inc.
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is ...
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