P87LPC764FN,112

NXP USA Inc. P87LPC764FN,112

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  • P87LPC764FN,112
  • NXP USA Inc.
  • IC MCU 8BIT 4KB OTP 20DIP
  • Embedded - Microcontrollers
  • P87LPC764FN,112 Datasheet
  • 20-DIP (0.300\", 7.62mm)
  • Tray
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 6957
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
P87LPC764FN,112
Category
Embedded - Microcontrollers
Manufacturer
NXP USA Inc.
Description
IC MCU 8BIT 4KB OTP 20DIP
Package
Tray
Series
LPC700
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Through Hole
Package / Case
20-DIP (0.300\", 7.62mm)
Supplier Device Package
20-DIP
Voltage - Supply (Vcc/Vdd)
2.7V ~ 6V
Speed
20MHz
Number of I/O
18
EEPROM Size
-
Core Processor
8051
RAM Size
128 x 8
Core Size
8-Bit
Connectivity
I²C, UART/USART
Peripherals
Brown-out Detect/Reset, LED, POR, WDT
Program Memory Size
4KB (4K x 8)
Program Memory Type
OTP
Data Converters
-
Oscillator Type
Internal
Package_case
20-DIP (0.300\", 7.62mm)

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NXP USA Inc.
NXP USA Inc.
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is ...
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