S1C17W22D00B000

Epson Electronics America Inc-Semiconductor Div S1C17W22D00B000

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  • S1C17W22D00B000
  • Epson Electronics America Inc-Semiconductor Div
  • IC MCU 16BIT 64KB FLASH DIE
  • Embedded - Microcontrollers
  • S1C17W22D00B000 Datasheet
  • Die
  • Tape & Reel (TR)
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 27876
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
S1C17W22D00B000
Category
Embedded - Microcontrollers
Manufacturer
Epson Electronics America Inc-Semiconductor Div
Description
IC MCU 16BIT 64KB FLASH DIE
Package
Tape & Reel (TR)
Series
-
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
Die
Supplier Device Package
Die
Voltage - Supply (Vcc/Vdd)
1.2V ~ 3.6V
Speed
4.2MHz
Number of I/O
41
EEPROM Size
-
Core Processor
S1C17
RAM Size
4K x 8
Core Size
16-Bit
Connectivity
I²C, IrDA, SPI, UART/USART
Peripherals
LCD, PWM, RFC, WDT
Program Memory Size
64KB (64K x 8)
Program Memory Type
FLASH
Data Converters
-
Oscillator Type
Internal
Package_case
Die

S1C17W22D00B000 Guarantees

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• Guaranteed Quality

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Do you have any questions about S1C17W22D00B000 ?
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+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
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