TLW-101-05-T-S

Samtec Inc. TLW-101-05-T-S

The picture is for reference only, please refer to the product specification

  • TLW-101-05-T-S
  • Samtec Inc.
  • CONN HEADER .100" 1POS SNGL TIN
  • Rectangular Connectors - Headers, Male Pins
  • TLW-101-05-T-S Datasheet
  • -
  • -
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 1720
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
TLW-101-05-T-S
Category
Rectangular Connectors - Headers, Male Pins
Manufacturer
Samtec Inc.
Description
CONN HEADER .100" 1POS SNGL TIN
Package
-
Series
Flex Stack, TLW
Operating Temperature
-55°C ~ 105°C
Mounting Type
Through Hole
Termination
Solder
Style
Board to Board or Cable
Current Rating
5.2A per Contact
Contact Material
Phosphor Bronze
Number of Positions
1
Connector Type
Header
Number of Positions Loaded
All
Number of Rows
1
Insulation Color
Black
Contact Type
Male Pin
Fastening Type
Push-Pull
Shrouding
Unshrouded
Contact Length - Mating
0.105" (2.67mm)
Contact Length - Post
0.170" (4.32mm)
Insulation Height
0.060" (1.52mm)
Contact Shape
Square
Contact Finish - Mating
Tin
Contact Finish - Post
Tin
Insulation Material
Liquid Crystal Polymer (LCP)
Overall Contact Length
0.335" (8.51mm)
Package_case
-

TLW-101-05-T-S Guarantees

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• Prompt Responsiveness

• Guaranteed Quality

• Global Access

• Competitive Market Price

• One-Stop support services of supply chain

Jinftry, Your most trustworthy component supplier, welcome to send us the inquiry, thank you!

Do you have any questions about TLW-101-05-T-S ?
Feel free to contact us:

+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Email first will be appreciative )

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Samtec Inc.
Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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