Samtec Inc. TMS-108-02-S-S-RA-002
- TMS-108-02-S-S-RA-002
- Samtec Inc.
- CONN HEADER 8POS .050" T/H GOLD
- Rectangular Connectors - Headers, Male Pins
- TMS-108-02-S-S-RA-002 Datasheet
- -
- -
- Lead free / RoHS Compliant
- 3699
- Spot Inventory / Athorized Dstributor / Factory Excess Stock
- 1 year quality assurance 》
- Click to get rates
Part Number TMS-108-02-S-S-RA-002 |
Category Rectangular Connectors - Headers, Male Pins |
Manufacturer Samtec Inc. |
Description CONN HEADER 8POS .050" T/H GOLD |
Package - |
Series TMS |
Operating Temperature -55°C ~ 125°C |
Mounting Type Through Hole, Right Angle |
Termination Solder |
Style Board to Board |
Current Rating 5A per Contact |
Contact Material Phosphor Bronze |
Number of Positions 8 |
Connector Type Header |
Number of Positions Loaded 7 |
Number of Rows 1 |
Insulation Color Black |
Contact Type Male Pin |
Fastening Type Push-Pull |
Material Flammability Rating UL94 V-0 |
Pitch - Mating 0.050" (1.27mm) |
Shrouding Unshrouded |
Contact Length - Mating 0.100" (2.54mm) |
Contact Length - Post 0.140" (3.56mm) |
Insulation Height 0.098" (2.50mm) |
Contact Shape Square |
Contact Finish - Mating Gold |
Contact Finish - Post Tin |
Insulation Material Liquid Crystal Polymer (LCP) |
Contact Finish Thickness - Mating 30µin (0.76µm) |
Package_case - |
TMS-108-02-S-S-RA-002 Guarantees
• Prompt Responsiveness
• Guaranteed Quality
• Global Access
• Competitive Market Price
• One-Stop support services of supply chain
Jinftry, Your most trustworthy component supplier, welcome to send us the inquiry, thank you!
Do you have any questions about TMS-108-02-S-S-RA-002 ?
Feel free to contact us:
+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Email first will be appreciative )
Customer reviews
Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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