24LC128-E/MF vs PCF8594C-2T/02,118

Part Number
24LC128-E/MF
PCF8594C-2T/02,118
Category General Memory General Memory
Manufacturer Microchip Technology NXP USA Inc.
Description IC EEPROM 128KBIT I2C 8DFN IC EEPROM 4KBIT I2C 100KHZ 8SO
Package Tube Tape & Reel (TR)
Series - -
Voltage - Supply 2.5V ~ 5.5V 2.5V ~ 6.0V
Operating Temperature -40°C ~ 125°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 8-VDFN Exposed Pad 8-SOIC (0.154\", 3.90mm Width)
Supplier Device Package 8-DFN-S (6x5) 8-SO
Memory Size 128Kb (16K x 8) 4Kb (512 x 8)
Technology EEPROM EEPROM
Memory Type Non-Volatile Non-Volatile
Clock Frequency 400 kHz 100 kHz
Access Time 900 ns -
Memory Format EEPROM EEPROM
Write Cycle Time - Word, Page 5ms -
Memory Interface I²C I²C
  • 1. What is the difference between RAM and ROM?

    RAM is volatile storage and is used to temporarily store data; while ROM is non-volatile storage, which can still save data after the device is turned off, and is usually used to store unchangeable data such as system startup programs.

  • 2. What is the difference between cache and RAM?

    Cache is a high-speed memory between the CPU and the main memory, which is used to temporarily store data and instructions commonly used by the CPU to speed up the system. RAM is the main storage of the system, which is used to store data for applications and operating systems.

  • 3. What is double data rate (DDR) memory?

    DDR memory is a RAM technology that can transmit data at both the rising and falling edges of the clock signal to increase the data transmission speed. There are multiple generations of DDR, such as DDR3, DDR4, DDR5, etc., each generation has higher speed and capacity and lower power consumption.

  • 4. What is High Bandwidth Memory (HBM) and what are its advantages?

    HBM is a high-bandwidth, low-latency memory technology commonly used in graphics cards and AI accelerators that can handle a large number of parallel computing tasks. HBM's stacked architecture makes it take up less space and more efficient, making it an ideal choice for big data and high-performance computing applications.

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