AS4C16M16MSA-6BIN vs AS4C128M8D3LB-12BIN

Part Number
AS4C16M16MSA-6BIN
AS4C128M8D3LB-12BIN
Category General Memory General Memory
Manufacturer Alliance Memory, Inc. Alliance Memory, Inc.
Description IC DRAM 256MBIT PARALLEL 54FBGA IC DRAM 1GBIT PARALLEL 78FBGA
Package Tray Tray
Series - -
Voltage - Supply 1.7V ~ 1.95V 1.283V ~ 1.45V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 95°C (TC)
Mounting Type Surface Mount Surface Mount
Package / Case 54-VFBGA 78-VFBGA
Supplier Device Package 54-FBGA (8x8) 78-FBGA (8x10.5)
Memory Size 256Mb (16M x 16) 1Gb (128M x 8)
Technology SDRAM - Mobile SDRAM SDRAM - DDR3L
Memory Type Volatile Volatile
Clock Frequency 166 MHz 800 MHz
Access Time 5.5 ns 20 ns
Memory Format DRAM DRAM
Write Cycle Time - Word, Page - 15ns
Memory Interface Parallel Parallel
  • 1. Is there a relationship between the capacity and speed of memory?

    The capacity and speed of memory are not directly related. The capacity refers to the amount of data that the memory can hold, while the speed determines the speed at which the memory reads and writes data. Generally speaking, faster memory such as RAM has a smaller capacity, while large-capacity storage such as HDD is relatively slow.

  • 2. What is SSD and how to distinguish it from HDD?

    SSD (Solid State Drive) is a non-volatile storage device that stores data through flash memory. It has faster read and write speeds than HDD (Hard Disk Drive), no mechanical structure, and long life, but the price is relatively higher.

  • 3. How to extend the life of memory devices?

    Measures such as regular data backup, avoiding excessive reading and writing of memory, ensuring proper temperature control, and preventing power fluctuations can help extend the life of memory.

  • 4. What is High Bandwidth Memory (HBM) and what are its advantages?

    HBM is a high-bandwidth, low-latency memory technology commonly used in graphics cards and AI accelerators that can handle a large number of parallel computing tasks. HBM's stacked architecture makes it take up less space and more efficient, making it an ideal choice for big data and high-performance computing applications.

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