BAT721C/ZLR vs PMEG3010BEA/ZLF
| Part Number |
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| Category | Diodes - Rectifiers - Single | Diodes - Rectifiers - Single |
| Manufacturer | NXP USA Inc. | NXP USA Inc. |
| Description | DIODE SCHOTTKY TO-236AB | DIODE SCHOTTKY SOD323 |
| Package | Tape & Reel (TR) | Tape & Reel (TR) |
| Series | - | - |
| Mounting Type | - | - |
| Package / Case | - | - |
| Supplier Device Package | - | - |
| Diode Type | - | - |
| Current - Average Rectified (Io) | - | - |
| Voltage - Forward (Vf) (Max) @ If | - | - |
| Current - Reverse Leakage @ Vr | - | - |
| Capacitance @ Vr, F | - | - |
| Voltage - DC Reverse (Vr) (Max) | - | - |
| Speed | - | - |
| Reverse Recovery Time (trr) | - | - |
| Operating Temperature - Junction | - | - |
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1. How to choose the appropriate rectifier diode?
When making a choice, the following factors need to be considered:
Current capacity: Determine the maximum current that the diode needs to handle.
Reverse voltage: Ensure that the reverse voltage of the diode can withstand the highest voltage in the circuit.
Forward voltage drop: A lower forward voltage drop can improve circuit efficiency.
Recovery time: For high-frequency applications, choose fast recovery or Schottky diodes. -
2. What is forward voltage drop?
Forward voltage drop refers to the voltage drop generated when the current passes through a diode when it is conducting. The forward voltage drop of silicon rectifier diodes is usually around 0.7V, while the forward voltage drop of Schottky diodes is usually lower, between 0.2V and 0.3V.
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3. What is the difference between a single rectifier diode and a bridge rectifier?
A single rectifier diode can only rectify the positive half wave of AC power (half wave rectification), while a bridge rectifier composed of four diodes can rectify the positive and negative half waves of AC power (full wave rectification), with higher efficiency and smoother output.
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4. What are the packaging types of rectifier diodes?
There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.
