BAT721C/ZLR vs SS310 R6
| Part Number |
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| Category | Diodes - Rectifiers - Single | Diodes - Rectifiers - Single |
| Manufacturer | NXP USA Inc. | Taiwan Semiconductor Corporation |
| Description | DIODE SCHOTTKY TO-236AB | DIODE SCHOTTKY DO214AB |
| Package | Tape & Reel (TR) | Tape & Reel (TR) |
| Series | - | - |
| Mounting Type | - | Surface Mount |
| Package / Case | - | DO-214AB, SMC |
| Supplier Device Package | - | DO-214AB (SMC) |
| Diode Type | - | Schottky |
| Current - Average Rectified (Io) | - | 3A (DC) |
| Voltage - Forward (Vf) (Max) @ If | - | 850 mV @ 3 A |
| Current - Reverse Leakage @ Vr | - | 100 µA @ 100 V |
| Capacitance @ Vr, F | - | - |
| Voltage - DC Reverse (Vr) (Max) | - | 100 V |
| Speed | - | Fast Recovery =< 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | - | - |
| Operating Temperature - Junction | - | -55°C ~ 150°C |
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1. What is forward voltage drop?
Forward voltage drop refers to the voltage drop generated when the current passes through a diode when it is conducting. The forward voltage drop of silicon rectifier diodes is usually around 0.7V, while the forward voltage drop of Schottky diodes is usually lower, between 0.2V and 0.3V.
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2. What is the difference between Schottky diodes and traditional silicon rectifier diodes?
Schottky diodes have a lower forward voltage drop (typically 0.2V to 0.3V) and faster switching speed, making them suitable for high-frequency applications. However, their reverse voltage is relatively low and is typically used in circuits with lower voltages.
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3. How to determine if the rectifier diode is damaged?
Use a multimeter to measure the forward and reverse resistance of a diode. If the diode exhibits low impedance or high impedance in both directions, it may have been damaged. Under normal circumstances, there should be low impedance when conducting in the forward direction, and high impedance when conducting in the reverse direction.
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4. What are the packaging types of rectifier diodes?
There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.
