BYV29G-600,127 vs FMY-1036S

Part Number
BYV29G-600,127
FMY-1036S
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer WeEn Semiconductors Sanken
Description DIODE GEN PURP 600V 9A I2PAK DIODE GEN PURP 600V 3A TO220F-2L
Package Tape & Reel (TR) Tube
Series - -
Mounting Type Through Hole Through Hole
Package / Case TO-262-3 Long Leads, I²Pak, TO-262AA TO-220-2 Full Pack
Supplier Device Package I2PAK TO-220F-2L
Diode Type Standard Standard
Current - Average Rectified (Io) 9A 3A
Voltage - Forward (Vf) (Max) @ If 1.25 V @ 8 A 1.15 V @ 3 A
Current - Reverse Leakage @ Vr 50 µA @ 600 V 10 µA @ 600 V
Capacitance @ Vr, F - -
Voltage - DC Reverse (Vr) (Max) 600 V 600 V
Speed Fast Recovery =< 500ns, > 200mA (Io) Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr) 60 ns 200 ns
Operating Temperature - Junction 150°C (Max) -40°C ~ 150°C
  • 1. What is a single rectifier diode?

    A single rectifier diode is an electronic component used to convert alternating current (AC) to direct current (DC), typically used in power supplies, chargers, and other circuits that require DC power.

  • 2. What is the maximum reverse voltage (PIV) of a rectifier diode?

    The Peak Inverse Voltage (PIV) is the maximum reverse voltage that a diode can withstand. When selecting a diode, the PIV must be higher than the maximum reverse voltage in the circuit, usually twice or more the input voltage.

  • 3. What is the difference between Schottky diodes and traditional silicon rectifier diodes?

    Schottky diodes have a lower forward voltage drop (typically 0.2V to 0.3V) and faster switching speed, making them suitable for high-frequency applications. However, their reverse voltage is relatively low and is typically used in circuits with lower voltages.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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