CMR1F-06M TR13 vs MBR12U100L-TP

Part Number
CMR1F-06M TR13
MBR12U100L-TP
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer Central Semiconductor Corp Micro Commercial Co
Description DIODE GEN PURP 600V 1A SMA DIODE SCHOTTKY 100V 12A TO277
Package DO-214AC, SMA Tape & Reel (TR)
Series - -
Mounting Type Surface Mount Surface Mount
Package / Case DO-214AC, SMA TO-277, 3-PowerDFN
Supplier Device Package SMA TO-277-3
Diode Type Standard Schottky
Current - Average Rectified (Io) 1A 12A
Voltage - Forward (Vf) (Max) @ If 1.3V @ 1A 600 mV @ 12 A
Current - Reverse Leakage @ Vr 5µA @ 600V 500 µA @ 100 V
Capacitance @ Vr, F 15pF @ 4V, 1MHz -
Voltage - DC Reverse (Vr) (Max) 600V 100 V
Speed Fast Recovery =< 500ns, > 200mA (Io) Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr) 250ns -
Operating Temperature - Junction -65°C ~ 150°C -55°C ~ 150°C
  • 1. What are the common applications of a single rectifier diode?

    They are commonly used in power circuits, chargers, AC to DC converters, motor drives, circuit protection, and other electronic devices to convert AC power to DC power or protect circuits from reverse current.

  • 2. What is the maximum reverse voltage (PIV) of a rectifier diode?

    The Peak Inverse Voltage (PIV) is the maximum reverse voltage that a diode can withstand. When selecting a diode, the PIV must be higher than the maximum reverse voltage in the circuit, usually twice or more the input voltage.

  • 3. How to improve the efficiency of rectifier diodes?

    The use of Schottky diodes or fast recovery diodes can reduce forward voltage drop and reverse recovery time, thereby improving the efficiency of rectifier circuits, especially in high-frequency applications.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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