ES3A-M3/57T vs SBR3U60P5-13D

Part Number
ES3A-M3/57T
SBR3U60P5-13D
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer Vishay Semiconductor - Diodes Division Diodes Incorporated
Description DIODE GEN PURP 50V 3A DO214AB DIODE SBR 60V 3A PDI5
Package Tape & Reel (TR) Tape & Reel (TR)
Series - Automotive, AEC-Q101
Mounting Type Surface Mount Surface Mount
Package / Case DO-214AB, SMC PowerDI™ 5
Supplier Device Package DO-214AB (SMC) PowerDI™ 5
Diode Type Standard Super Barrier
Current - Average Rectified (Io) 3A 3A
Voltage - Forward (Vf) (Max) @ If 900 mV @ 3 A 600 mV @ 3 A
Current - Reverse Leakage @ Vr 10 µA @ 50 V 60 µA @ 60 V
Capacitance @ Vr, F 45pF @ 4V, 1MHz 110pF @ 4V, 1MHz
Voltage - DC Reverse (Vr) (Max) 50 V 60 V
Speed Fast Recovery =< 500ns, > 200mA (Io) Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr) 30 ns -
Operating Temperature - Junction -55°C ~ 150°C -55°C ~ 175°C
  • 1. What is a single rectifier diode?

    A single rectifier diode is an electronic component used to convert alternating current (AC) to direct current (DC), typically used in power supplies, chargers, and other circuits that require DC power.

  • 2. What are the common applications of a single rectifier diode?

    They are commonly used in power circuits, chargers, AC to DC converters, motor drives, circuit protection, and other electronic devices to convert AC power to DC power or protect circuits from reverse current.

  • 3. What is the maximum reverse voltage (PIV) of a rectifier diode?

    The Peak Inverse Voltage (PIV) is the maximum reverse voltage that a diode can withstand. When selecting a diode, the PIV must be higher than the maximum reverse voltage in the circuit, usually twice or more the input voltage.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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