FDH400 vs CS1G-E3/I
| Part Number |
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| Category | Diodes - Rectifiers - Single | Diodes - Rectifiers - Single |
| Manufacturer | ON Semiconductor | Vishay Semiconductor - Diodes Division |
| Description | DIODE GEN PURP 150V 200MA DO35 | DIODE GPP 400V 1.0A DO-214AC |
| Package | Tape & Reel (TR) | -Reel® |
| Series | - | - |
| Mounting Type | Through Hole | Surface Mount |
| Package / Case | DO-204AH, DO-35, Axial | DO-214AC, SMA |
| Supplier Device Package | DO-35 | DO-214AC (SMA) |
| Diode Type | Standard | Standard |
| Current - Average Rectified (Io) | 200mA | 1A |
| Voltage - Forward (Vf) (Max) @ If | 1.1 V @ 300 mA | 1.1 V @ 1 A |
| Current - Reverse Leakage @ Vr | 100 nA @ 150 V | 5 µA @ 400 V |
| Capacitance @ Vr, F | 2pF @ 0V, 1MHz | 6pF @ 4V, 1MHz |
| Voltage - DC Reverse (Vr) (Max) | 150 V | 400 V |
| Speed | Small Signal =< 200mA (Io), Any Speed | Standard Recovery >500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | 50 ns | 1.5 µs |
| Operating Temperature - Junction | 175°C (Max) | -55°C ~ 150°C |
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1. What is a single rectifier diode?
A single rectifier diode is an electronic component used to convert alternating current (AC) to direct current (DC), typically used in power supplies, chargers, and other circuits that require DC power.
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2. What is a fast recovery diode?
Fast recovery diode is a special type of rectifier diode with a short reverse recovery time, suitable for high-frequency power supplies and switch mode power supplies (SMPS) applications, reducing switching losses.
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3. How to improve the efficiency of rectifier diodes?
The use of Schottky diodes or fast recovery diodes can reduce forward voltage drop and reverse recovery time, thereby improving the efficiency of rectifier circuits, especially in high-frequency applications.
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4. What are the packaging types of rectifier diodes?
There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.
