IS25LQ040B-JBLE vs 24LC08B-I/ST

Part Number
IS25LQ040B-JBLE
24LC08B-I/ST
Category General Memory General Memory
Manufacturer ISSI, Integrated Silicon Solution Inc Microchip Technology
Description IC FLASH 4MBIT SPI/QUAD 8SOIC IC EEPROM 8KBIT I2C 8TSSOP
Package -Reel® Cut Tape (CT)
Series - -
Voltage - Supply 2.3V ~ 3.6V 2.5V ~ 5.5V
Operating Temperature -40°C ~ 105°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 8-SOIC (0.209\", 5.30mm Width) 8-TSSOP (0.173\", 4.40mm Width)
Supplier Device Package 8-SOIC 8-TSSOP
Memory Size 4Mb (512K x 8) 8Kb (256 x 8 x 4)
Technology FLASH - NOR EEPROM
Memory Type Non-Volatile Non-Volatile
Clock Frequency 104 MHz 400 kHz
Access Time - 900 ns
Memory Format FLASH EEPROM
Write Cycle Time - Word, Page 800µs 5ms
Memory Interface SPI - Quad I/O I²C
  • 1. What is the memory hierarchy in a computer?

    The computer memory hierarchy includes registers, cache, main memory (RAM), secondary storage (such as HDD or SSD), and external storage (such as tape, optical disk) from speed to capacity, and each level has different storage and access speeds.

  • 2. What is the difference between SRAM and DRAM?

    SRAM (static RAM) does not require periodic refreshes and is faster but more expensive; DRAM (dynamic RAM) requires periodic refreshes and has a higher storage density and is suitable for main memory.

  • 3. How to extend the life of memory devices?

    Measures such as regular data backup, avoiding excessive reading and writing of memory, ensuring proper temperature control, and preventing power fluctuations can help extend the life of memory.

  • 4. What is High Bandwidth Memory (HBM) and what are its advantages?

    HBM is a high-bandwidth, low-latency memory technology commonly used in graphics cards and AI accelerators that can handle a large number of parallel computing tasks. HBM's stacked architecture makes it take up less space and more efficient, making it an ideal choice for big data and high-performance computing applications.

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