M95M01-DFDW6TP vs M24512-WDW6TP

Part Number
M95M01-DFDW6TP
M24512-WDW6TP
Category General Memory General Memory
Manufacturer STMicroelectronics STMicroelectronics
Description IC EEPROM 1MBIT SPI 16MHZ 8TSSOP IC EEPROM 512KBIT I2C 8TSSOP
Package Tape & Reel (TR) Cut Tape (CT)
Series - -
Voltage - Supply 1.7V ~ 5.5V 2.5V ~ 5.5V
Operating Temperature -40°C ~ 85°C (TA) -40°C ~ 85°C (TA)
Mounting Type Surface Mount Surface Mount
Package / Case 8-TSSOP (0.173\", 4.40mm Width) 8-TSSOP (0.173\", 4.40mm Width)
Supplier Device Package 8-TSSOP 8-TSSOP
Memory Size 1Mb (128K x 8) 512Kb (64K x 8)
Technology EEPROM EEPROM
Memory Type Non-Volatile Non-Volatile
Clock Frequency 16 MHz 1 MHz
Access Time - 500 ns
Memory Format EEPROM EEPROM
Write Cycle Time - Word, Page 5ms 5ms
Memory Interface SPI I²C
  • 1. What are the main types of memory?

    Common memory types include random access memory (RAM), read-only memory (ROM), flash memory, hard disk drive (HDD), and solid-state drive (SSD).

  • 2. Is there a relationship between the capacity and speed of memory?

    The capacity and speed of memory are not directly related. The capacity refers to the amount of data that the memory can hold, while the speed determines the speed at which the memory reads and writes data. Generally speaking, faster memory such as RAM has a smaller capacity, while large-capacity storage such as HDD is relatively slow.

  • 3. What is the memory hierarchy in a computer?

    The computer memory hierarchy includes registers, cache, main memory (RAM), secondary storage (such as HDD or SSD), and external storage (such as tape, optical disk) from speed to capacity, and each level has different storage and access speeds.

  • 4. What is High Bandwidth Memory (HBM) and what are its advantages?

    HBM is a high-bandwidth, low-latency memory technology commonly used in graphics cards and AI accelerators that can handle a large number of parallel computing tasks. HBM's stacked architecture makes it take up less space and more efficient, making it an ideal choice for big data and high-performance computing applications.

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