MBR5200VP-G1 vs SS315HM6G
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| Category | Diodes - Rectifiers - Single | Diodes - Rectifiers - Single |
| Manufacturer | Diodes Incorporated | Taiwan Semiconductor Corporation |
| Description | DIODE SCHOTTKY 200V 5A DO27 | DIODE SCHOTTKY 150V 3A DO214AB |
| Package | Bulk | Tape & Reel (TR) |
| Series | - | Automotive, AEC-Q101 |
| Mounting Type | Through Hole | Surface Mount |
| Package / Case | DO-201AA, DO-27, Axial | DO-214AB, SMC |
| Supplier Device Package | DO-27 | DO-214AB (SMC) |
| Diode Type | Schottky | Schottky |
| Current - Average Rectified (Io) | 5A | 3A |
| Voltage - Forward (Vf) (Max) @ If | 950 mV @ 5 A | 950 mV @ 3 A |
| Current - Reverse Leakage @ Vr | 500 µA @ 200 V | 100 µA @ 150 V |
| Capacitance @ Vr, F | - | - |
| Voltage - DC Reverse (Vr) (Max) | 200 V | 150 V |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | - | - |
| Operating Temperature - Junction | -65°C ~ 150°C | -55°C ~ 150°C |
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1. What is the maximum reverse voltage (PIV) of a rectifier diode?
The Peak Inverse Voltage (PIV) is the maximum reverse voltage that a diode can withstand. When selecting a diode, the PIV must be higher than the maximum reverse voltage in the circuit, usually twice or more the input voltage.
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2. What is the reverse recovery time of a rectifier diode?
Reverse recovery time refers to the time required for a diode to transition from a forward conducting state to a reverse blocking state. A shorter reverse recovery time is particularly important in high-frequency applications to reduce power loss.
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3. How to identify the polarity of a single rectifier diode?
Rectifying diodes usually have polarity markings, with the positive (anode) of the diode being "+" and the negative (cathode) being "-". On the packaging of diodes, there is usually a circular mark on the cathode side indicating the direction of the diode.
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4. What are the packaging types of rectifier diodes?
There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.
