RS3A-M3/57T vs RS3D-M3/57T

Part Number
RS3A-M3/57T
RS3D-M3/57T
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer Vishay Semiconductor - Diodes Division Vishay Semiconductor - Diodes Division
Description DIODE GEN PURP 50V 3A DO214AB DIODE GEN PURP 200V 3A DO214AB
Package Tape & Reel (TR) Tape & Reel (TR)
Series - -
Mounting Type Surface Mount Surface Mount
Package / Case DO-214AB, SMC DO-214AB, SMC
Supplier Device Package DO-214AB (SMC) DO-214AB (SMC)
Diode Type Standard Standard
Current - Average Rectified (Io) 3A 3A
Voltage - Forward (Vf) (Max) @ If 1.3 V @ 2.5 A 1.3 V @ 2.5 A
Current - Reverse Leakage @ Vr 10 µA @ 50 V 10 µA @ 200 V
Capacitance @ Vr, F 44pF @ 4V, 1MHz 44pF @ 4V, 1MHz
Voltage - DC Reverse (Vr) (Max) 50 V 200 V
Speed Fast Recovery =< 500ns, > 200mA (Io) Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr) 150 ns 150 ns
Operating Temperature - Junction -55°C ~ 150°C -55°C ~ 150°C
  • 1. What is a single rectifier diode?

    A single rectifier diode is an electronic component used to convert alternating current (AC) to direct current (DC), typically used in power supplies, chargers, and other circuits that require DC power.

  • 2. What is forward voltage drop?

    Forward voltage drop refers to the voltage drop generated when the current passes through a diode when it is conducting. The forward voltage drop of silicon rectifier diodes is usually around 0.7V, while the forward voltage drop of Schottky diodes is usually lower, between 0.2V and 0.3V.

  • 3. How to determine if the rectifier diode is damaged?

    Use a multimeter to measure the forward and reverse resistance of a diode. If the diode exhibits low impedance or high impedance in both directions, it may have been damaged. Under normal circumstances, there should be low impedance when conducting in the forward direction, and high impedance when conducting in the reverse direction.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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