S5KHE3_A/I vs S5MHE3_A/I

Part Number
S5KHE3_A/I
S5MHE3_A/I
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer Vishay Semiconductor - Diodes Division Vishay Semiconductor - Diodes Division
Description DIODE GEN PURP 800V 5A DO214AB DIODE GEN PURP 1KV 5A DO214AB
Package Tape & Reel (TR) Cut Tape (CT)
Series Automotive, AEC-Q101 Automotive, AEC-Q101
Mounting Type Surface Mount Surface Mount
Package / Case DO-214AB, SMC DO-214AB, SMC
Supplier Device Package DO-214AB (SMC) DO-214AB (SMC)
Diode Type Standard Standard
Current - Average Rectified (Io) 5A 5A
Voltage - Forward (Vf) (Max) @ If 1.15 V @ 5 A 1.15 V @ 5 A
Current - Reverse Leakage @ Vr 10 µA @ 800 V 10 µA @ 1000 V
Capacitance @ Vr, F 40pF @ 4V, 1MHz 40pF @ 4V, 1MHz
Voltage - DC Reverse (Vr) (Max) 800 V 1000 V
Speed Standard Recovery >500ns, > 200mA (Io) Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr) 2.5 µs 2.5 µs
Operating Temperature - Junction -55°C ~ 150°C -55°C ~ 150°C
  • 1. What is a single rectifier diode?

    A single rectifier diode is an electronic component used to convert alternating current (AC) to direct current (DC), typically used in power supplies, chargers, and other circuits that require DC power.

  • 2. What is forward voltage drop?

    Forward voltage drop refers to the voltage drop generated when the current passes through a diode when it is conducting. The forward voltage drop of silicon rectifier diodes is usually around 0.7V, while the forward voltage drop of Schottky diodes is usually lower, between 0.2V and 0.3V.

  • 3. What is the difference between Schottky diodes and traditional silicon rectifier diodes?

    Schottky diodes have a lower forward voltage drop (typically 0.2V to 0.3V) and faster switching speed, making them suitable for high-frequency applications. However, their reverse voltage is relatively low and is typically used in circuits with lower voltages.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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