SBL1630PT vs SBL1640CT
| Part Number |
|
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| Category | Diodes - Rectifiers - Arrays | Diodes - Rectifiers - Arrays |
| Manufacturer | Diodes Incorporated | Diodes Incorporated |
| Description | DIODE ARRAY SCHOTTKY 30V TO3P | DIODE ARRAY SCHOTTKY 40V TO220AB |
| Package | Tube | Tube |
| Series | - | - |
| Mounting Type | Through Hole | Through Hole |
| Package / Case | TO-3P-3, SC-65-3 | TO-220-3 |
| Supplier Device Package | TO-3P | TO-220-3 |
| Diode Type | Schottky | Schottky |
| Voltage - Forward (Vf) (Max) @ If | 550 mV @ 8 A | 550 mV @ 8 A |
| Current - Reverse Leakage @ Vr | 500 µA @ 30 V | 500 µA @ 40 V |
| Diode Configuration | 1 Pair Common Cathode | 1 Pair Common Cathode |
| Voltage - DC Reverse (Vr) (Max) | 30 V | 40 V |
| Current - Average Rectified (Io) (per Diode) | 16A | 16A |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | - | - |
| Operating Temperature - Junction | -65°C ~ 150°C | -65°C ~ 150°C |
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1. What is a rectifier diode array?
A rectifier diode array is a group of multiple diodes packaged in a single component, typically used for multiple rectifier applications or circuit protection. They can simplify circuit design and save space, and are widely used in power conversion, signal rectification, and circuit protection.
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2. What is the function of a rectifier diode array?
The rectifier diode array is used to convert alternating current (AC) to direct current (DC), or for circuit protection (such as preventing current backflow), and is also commonly used for voltage clamping and surge protection in circuits.
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3. How can rectifier diode arrays simplify circuit design?
The use of rectifier diode arrays can reduce the need to install multiple diodes separately, simplify circuit layout, reduce PCB space occupation, and improve the overall reliability of the circuit.
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4. What packaging types does the rectifier diode array support?
Common packaging includes SMD (Surface Mount), DIP (Dual In Line), and TO packaging, which are suitable for different installation requirements. SMD packaging is suitable for space constrained designs, while DIP and TO packaging are suitable for higher power applications.
