SBRT10U60D1Q-13 vs FES8CT-E3/45

Part Number
SBRT10U60D1Q-13
FES8CT-E3/45
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer Diodes Incorporated Vishay Semiconductor - Diodes Division
Description DIODE SBR 60V 10A TO252 DIODE GEN PURP 150V 8A TO220AC
Package Cut Tape (CT) Tube
Series Automotive, AEC-Q101, SBR® -
Mounting Type Surface Mount Through Hole
Package / Case TO-252-3, DPak (2 Leads + Tab), SC-63 TO-220-2
Supplier Device Package TO-252, (D-Pak) TO-220AC
Diode Type Super Barrier Standard
Current - Average Rectified (Io) 10A 8A
Voltage - Forward (Vf) (Max) @ If 520 mV @ 10 A 950 mV @ 8 A
Current - Reverse Leakage @ Vr 400 µA @ 60 V 10 µA @ 150 V
Capacitance @ Vr, F - -
Voltage - DC Reverse (Vr) (Max) 60 V 150 V
Speed Fast Recovery =< 500ns, > 200mA (Io) Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr) - 35 ns
Operating Temperature - Junction -55°C ~ 150°C -55°C ~ 150°C
  • 1. What is the maximum reverse voltage (PIV) of a rectifier diode?

    The Peak Inverse Voltage (PIV) is the maximum reverse voltage that a diode can withstand. When selecting a diode, the PIV must be higher than the maximum reverse voltage in the circuit, usually twice or more the input voltage.

  • 2. What is the difference between a single rectifier diode and a bridge rectifier?

    A single rectifier diode can only rectify the positive half wave of AC power (half wave rectification), while a bridge rectifier composed of four diodes can rectify the positive and negative half waves of AC power (full wave rectification), with higher efficiency and smoother output.

  • 3. How to improve the efficiency of rectifier diodes?

    The use of Schottky diodes or fast recovery diodes can reduce forward voltage drop and reverse recovery time, thereby improving the efficiency of rectifier circuits, especially in high-frequency applications.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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