SJPB-H4V vs EP01CV0
| Part Number |
|
|
| Category | Diodes - Rectifiers - Single | Diodes - Rectifiers - Single |
| Manufacturer | Sanken | Sanken |
| Description | DIODE SCHOTTKY 40V 2A SJP | DIODE GEN PURP 1KV 200MA AXIAL |
| Package | Bulk | Tape & Box (TB) |
| Series | - | - |
| Mounting Type | Surface Mount | Through Hole |
| Package / Case | 2-SMD, J-Lead | Axial |
| Supplier Device Package | SJP | - |
| Diode Type | Schottky | Standard |
| Current - Average Rectified (Io) | 2A | 200mA |
| Voltage - Forward (Vf) (Max) @ If | 550 mV @ 2 A | 4 V @ 200 mA |
| Current - Reverse Leakage @ Vr | 200 µA @ 40 V | 5 µA @ 1000 V |
| Capacitance @ Vr, F | - | - |
| Voltage - DC Reverse (Vr) (Max) | 40 V | 1000 V |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | Small Signal =< 200mA (Io), Any Speed |
| Reverse Recovery Time (trr) | - | 200 ns |
| Operating Temperature - Junction | -40°C ~ 150°C | -40°C ~ 150°C |
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1. What is forward voltage drop?
Forward voltage drop refers to the voltage drop generated when the current passes through a diode when it is conducting. The forward voltage drop of silicon rectifier diodes is usually around 0.7V, while the forward voltage drop of Schottky diodes is usually lower, between 0.2V and 0.3V.
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2. What is the maximum reverse voltage (PIV) of a rectifier diode?
The Peak Inverse Voltage (PIV) is the maximum reverse voltage that a diode can withstand. When selecting a diode, the PIV must be higher than the maximum reverse voltage in the circuit, usually twice or more the input voltage.
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3. How to identify the polarity of a single rectifier diode?
Rectifying diodes usually have polarity markings, with the positive (anode) of the diode being "+" and the negative (cathode) being "-". On the packaging of diodes, there is usually a circular mark on the cathode side indicating the direction of the diode.
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4. What are the packaging types of rectifier diodes?
There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.
