SRAS860 MNG vs SRAS820 MNG

Part Number
SRAS860 MNG
SRAS820 MNG
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer Taiwan Semiconductor Corporation Taiwan Semiconductor Corporation
Description DIODE SCHOTTKY 60V 8A TO263AB DIODE SCHOTTKY 20V 8A TO263AB
Package Tape & Reel (TR) Tape & Reel (TR)
Series - -
Mounting Type Surface Mount Surface Mount
Package / Case TO-263-3, D²Pak (2 Leads + Tab), TO-263AB TO-263-3, D²Pak (2 Leads + Tab), TO-263AB
Supplier Device Package TO-263AB (D²PAK) TO-263AB (D²PAK)
Diode Type Schottky Schottky
Current - Average Rectified (Io) 8A 8A
Voltage - Forward (Vf) (Max) @ If 700 mV @ 8 A 550 mV @ 8 A
Current - Reverse Leakage @ Vr 100 µA @ 60 V 100 µA @ 20 V
Capacitance @ Vr, F - -
Voltage - DC Reverse (Vr) (Max) 60 V 20 V
Speed Fast Recovery =< 500ns, > 200mA (Io) Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr) - -
Operating Temperature - Junction -55°C ~ 150°C -55°C ~ 125°C
  • 1. What are the common applications of a single rectifier diode?

    They are commonly used in power circuits, chargers, AC to DC converters, motor drives, circuit protection, and other electronic devices to convert AC power to DC power or protect circuits from reverse current.

  • 2. What is the difference between a single rectifier diode and a bridge rectifier?

    A single rectifier diode can only rectify the positive half wave of AC power (half wave rectification), while a bridge rectifier composed of four diodes can rectify the positive and negative half waves of AC power (full wave rectification), with higher efficiency and smoother output.

  • 3. How to improve the efficiency of rectifier diodes?

    The use of Schottky diodes or fast recovery diodes can reduce forward voltage drop and reverse recovery time, thereby improving the efficiency of rectifier circuits, especially in high-frequency applications.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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