SS10P4HM3_A/I vs NTS10100EMFST3G
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| Category | Diodes - Rectifiers - Single | Diodes - Rectifiers - Single |
| Manufacturer | Vishay Semiconductor - Diodes Division | ON Semiconductor |
| Description | DIODE SCHOTTKY 40V 10A TO277A | DIODE SCHOTTKY 100V 10A 5DFN |
| Package | Tape & Reel (TR) | -Reel® |
| Series | Automotive, AEC-Q101 | - |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | TO-277, 3-PowerDFN | 8-PowerTDFN, 5 Leads |
| Supplier Device Package | TO-277A (SMPC) | 5-DFN (5x6) (8-SOFL) |
| Diode Type | Schottky | Schottky |
| Current - Average Rectified (Io) | 10A | 10A |
| Voltage - Forward (Vf) (Max) @ If | 560 mV @ 10 A | 720 mV @ 10 A |
| Current - Reverse Leakage @ Vr | 800 µA @ 40 V | 70 µA @ 100 V |
| Capacitance @ Vr, F | 750pF @ 4V, 1MHz | - |
| Voltage - DC Reverse (Vr) (Max) | 40 V | 100 V |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | - | - |
| Operating Temperature - Junction | -55°C ~ 150°C | -55°C ~ 150°C |
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1. What is the working principle of a single rectifier diode?
A rectifier diode conducts current when forward biased, converting the positive half wave of alternating current into direct current. When reverse biased, the diode blocks the current, thereby preventing the negative half wave from passing through and achieving rectification effect.
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2. What is the maximum reverse voltage (PIV) of a rectifier diode?
The Peak Inverse Voltage (PIV) is the maximum reverse voltage that a diode can withstand. When selecting a diode, the PIV must be higher than the maximum reverse voltage in the circuit, usually twice or more the input voltage.
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3. How to improve the efficiency of rectifier diodes?
The use of Schottky diodes or fast recovery diodes can reduce forward voltage drop and reverse recovery time, thereby improving the efficiency of rectifier circuits, especially in high-frequency applications.
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4. What are the packaging types of rectifier diodes?
There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.
