SS3P3LHM3_A/I vs VS-3ECH01-M3/9AT

Part Number
SS3P3LHM3_A/I
VS-3ECH01-M3/9AT
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer Vishay Semiconductor - Diodes Division Vishay Semiconductor - Diodes Division
Description DIODE SCHOTTKY 30V 3A TO277A DIODE GEN PURP 100V 3A SMC
Package Tape & Reel (TR) Tape & Reel (TR)
Series Automotive, AEC-Q101 FRED Pt®
Mounting Type Surface Mount Surface Mount
Package / Case TO-277, 3-PowerDFN DO-214AB, SMC
Supplier Device Package TO-277A (SMPC) DO-214AB (SMC)
Diode Type Schottky Standard
Current - Average Rectified (Io) 3A 3A
Voltage - Forward (Vf) (Max) @ If 470 mV @ 3 A 900 mV @ 3 A
Current - Reverse Leakage @ Vr 250 µA @ 30 V 2 µA @ 100 V
Capacitance @ Vr, F - -
Voltage - DC Reverse (Vr) (Max) 30 V 100 V
Speed Fast Recovery =< 500ns, > 200mA (Io) Standard Recovery >500ns, > 200mA (Io)
Reverse Recovery Time (trr) - -
Operating Temperature - Junction -55°C ~ 150°C -55°C ~ 175°C
  • 1. What is the reverse recovery time of a rectifier diode?

    Reverse recovery time refers to the time required for a diode to transition from a forward conducting state to a reverse blocking state. A shorter reverse recovery time is particularly important in high-frequency applications to reduce power loss.

  • 2. How to identify the polarity of a single rectifier diode?

    Rectifying diodes usually have polarity markings, with the positive (anode) of the diode being &quot;+&quot; and the negative (cathode) being &quot;-&quot;. On the packaging of diodes, there is usually a circular mark on the cathode side indicating the direction of the diode.

  • 3. How to improve the efficiency of rectifier diodes?

    The use of Schottky diodes or fast recovery diodes can reduce forward voltage drop and reverse recovery time, thereby improving the efficiency of rectifier circuits, especially in high-frequency applications.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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