SS5P3HM3_A/I vs STPS140UY
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| Category | Diodes - Rectifiers - Single | Diodes - Rectifiers - Single |
| Manufacturer | Vishay Semiconductor - Diodes Division | STMicroelectronics |
| Description | DIODE SCHOTTKY 30V 5A TO277A | DIODE SCHOTTKY 40V 1A SMB |
| Package | Tape & Reel (TR) | Tape & Reel (TR) |
| Series | Automotive, AEC-Q101 | Q Automotive |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | TO-277, 3-PowerDFN | DO-214AA, SMB |
| Supplier Device Package | TO-277A (SMPC) | SMB |
| Diode Type | Schottky | Schottky |
| Current - Average Rectified (Io) | 5A | 1A |
| Voltage - Forward (Vf) (Max) @ If | 520 mV @ 5 A | 650 mV @ 2 A |
| Current - Reverse Leakage @ Vr | 250 µA @ 30 V | 12 µA @ 40 V |
| Capacitance @ Vr, F | - | - |
| Voltage - DC Reverse (Vr) (Max) | 30 V | 40 V |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | - | - |
| Operating Temperature - Junction | -55°C ~ 150°C | -40°C ~ 150°C |
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1. What is a fast recovery diode?
Fast recovery diode is a special type of rectifier diode with a short reverse recovery time, suitable for high-frequency power supplies and switch mode power supplies (SMPS) applications, reducing switching losses.
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2. Can a single rectifier diode be used for high-frequency applications?
Traditional silicon rectifier diodes are not suitable for high-frequency applications because their reverse recovery time is relatively long. For high-frequency applications, fast recovery diodes or Schottky diodes are typically used to reduce switching losses and improve efficiency.
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3. What is the reverse recovery time of a rectifier diode?
Reverse recovery time refers to the time required for a diode to transition from a forward conducting state to a reverse blocking state. A shorter reverse recovery time is particularly important in high-frequency applications to reduce power loss.
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4. What are the packaging types of rectifier diodes?
There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.
