STPS40100CT vs STPS30H60CG
| Part Number |
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| Category | Diodes - Rectifiers - Arrays | Diodes - Rectifiers - Arrays |
| Manufacturer | STMicroelectronics | STMicroelectronics |
| Description | DIODE ARRAY SCHOTTKY 100V TO220 | DIODE ARRAY SCHOTTKY 60V D2PAK |
| Package | Tube | Tube |
| Series | - | - |
| Mounting Type | Through Hole | Surface Mount |
| Package / Case | TO-220-3 | TO-263-3, D²Pak (2 Leads + Tab), TO-263AB |
| Supplier Device Package | TO-220 | D2PAK |
| Diode Type | Schottky | Schottky |
| Voltage - Forward (Vf) (Max) @ If | - | 660 mV @ 15 A |
| Current - Reverse Leakage @ Vr | - | 60 µA @ 60 V |
| Diode Configuration | 1 Pair Common Cathode | 1 Pair Common Cathode |
| Voltage - DC Reverse (Vr) (Max) | 100 V | 60 V |
| Current - Average Rectified (Io) (per Diode) | 20A (DC) | 15A |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | - | - |
| Operating Temperature - Junction | - | 175°C (Max) |
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1. What is a rectifier diode array?
A rectifier diode array is a group of multiple diodes packaged in a single component, typically used for multiple rectifier applications or circuit protection. They can simplify circuit design and save space, and are widely used in power conversion, signal rectification, and circuit protection.
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2. What is the function of a rectifier diode array?
The rectifier diode array is used to convert alternating current (AC) to direct current (DC), or for circuit protection (such as preventing current backflow), and is also commonly used for voltage clamping and surge protection in circuits.
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3. What are the typical applications of rectifier diode arrays?
They are widely used in power modules, chargers, communication equipment, automotive electronics, industrial control systems, and motor drives, especially in complex circuits that require multiple rectification paths.
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4. What packaging types does the rectifier diode array support?
Common packaging includes SMD (Surface Mount), DIP (Dual In Line), and TO packaging, which are suitable for different installation requirements. SMD packaging is suitable for space constrained designs, while DIP and TO packaging are suitable for higher power applications.
