STPS40100CT vs STTH602CFP
| Part Number |
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| Category | Diodes - Rectifiers - Arrays | Diodes - Rectifiers - Arrays |
| Manufacturer | STMicroelectronics | STMicroelectronics |
| Description | DIODE ARRAY SCHOTTKY 100V TO220 | DIODE ARRAY GP 200V 3A TO220FP |
| Package | Tube | Tube |
| Series | - | - |
| Mounting Type | Through Hole | Through Hole |
| Package / Case | TO-220-3 | TO-220-3 Full Pack |
| Supplier Device Package | TO-220 | TO-220FP |
| Diode Type | Schottky | Standard |
| Voltage - Forward (Vf) (Max) @ If | - | 1.1 V @ 3 A |
| Current - Reverse Leakage @ Vr | - | 3 µA @ 200 V |
| Diode Configuration | 1 Pair Common Cathode | 1 Pair Common Cathode |
| Voltage - DC Reverse (Vr) (Max) | 100 V | 200 V |
| Current - Average Rectified (Io) (per Diode) | 20A (DC) | 3A |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | - | 30 ns |
| Operating Temperature - Junction | - | 175°C (Max) |
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1. What is the function of a rectifier diode array?
The rectifier diode array is used to convert alternating current (AC) to direct current (DC), or for circuit protection (such as preventing current backflow), and is also commonly used for voltage clamping and surge protection in circuits.
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2. How can rectifier diode arrays simplify circuit design?
The use of rectifier diode arrays can reduce the need to install multiple diodes separately, simplify circuit layout, reduce PCB space occupation, and improve the overall reliability of the circuit.
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3. What are the advantages of a rectifier diode array compared to a single rectifier diode?
The array design integrates multiple diodes, which can reduce the number of components, simplify circuit design, save PCB space, and improve installation and production efficiency. It can also help reduce parasitic inductance and resistance, thereby improving performance.
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4. What packaging types does the rectifier diode array support?
Common packaging includes SMD (Surface Mount), DIP (Dual In Line), and TO packaging, which are suitable for different installation requirements. SMD packaging is suitable for space constrained designs, while DIP and TO packaging are suitable for higher power applications.
