UF3007-T vs SS10P3HM3_A/H

Part Number
UF3007-T
SS10P3HM3_A/H
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer Diodes Incorporated Vishay Semiconductor - Diodes Division
Description DIODE GEN PURP 1KV 3A DO201AD DIODE SCHOTTKY 30V 10A TO277A
Package Tape & Reel (TR) Tape & Reel (TR)
Series - Automotive, AEC-Q101
Mounting Type Through Hole Surface Mount
Package / Case DO-201AD, Axial TO-277, 3-PowerDFN
Supplier Device Package DO-201AD TO-277A (SMPC)
Diode Type Standard Schottky
Current - Average Rectified (Io) 3A 10A
Voltage - Forward (Vf) (Max) @ If 1.7 V @ 3 A 560 mV @ 10 A
Current - Reverse Leakage @ Vr 5 µA @ 1000 V 800 µA @ 30 V
Capacitance @ Vr, F 50pF @ 4V, 1MHz 750pF @ 4V, 1MHz
Voltage - DC Reverse (Vr) (Max) 1000 V 30 V
Speed Fast Recovery =< 500ns, > 200mA (Io) Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr) 75 ns -
Operating Temperature - Junction -65°C ~ 150°C -55°C ~ 150°C
  • 1. What are the common applications of a single rectifier diode?

    They are commonly used in power circuits, chargers, AC to DC converters, motor drives, circuit protection, and other electronic devices to convert AC power to DC power or protect circuits from reverse current.

  • 2. What is the maximum reverse voltage (PIV) of a rectifier diode?

    The Peak Inverse Voltage (PIV) is the maximum reverse voltage that a diode can withstand. When selecting a diode, the PIV must be higher than the maximum reverse voltage in the circuit, usually twice or more the input voltage.

  • 3. What is a fast recovery diode?

    Fast recovery diode is a special type of rectifier diode with a short reverse recovery time, suitable for high-frequency power supplies and switch mode power supplies (SMPS) applications, reducing switching losses.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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