Amphenol ICC (FCI) 61082-102109
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- 61082-102109
- Amphenol ICC (FCI)
- CONN RECEPT 100POS .8MM DUAL SMD
- Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
- 61082-102109 Datasheet
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Lead free / RoHS Compliant - 22921
- Spot Inventory / Athorized Dstributor / Factory Excess Stock
- 1 year quality assurance 》
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What is 61082-102109
Amphenol ICC (FCI) Part Number 61082-102109（Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)）, developed and manufactured by Amphenol ICC (FCI), distributed globally by Jinftry. We distribute various electronic components from world-renowned brands and provide one-stop services, making us a trusted global electronic component distributor.
61082-102109 is one of the part numbers distributed by Jinftry, and you can learn about its specifications/configurations, package/case, Datasheet, and other information here. Electronic components are affected by supply and demand, and prices fluctuate frequently. If you have a demand, please do not hesitate to send us an RFQ or email us immediately [email protected] Please inquire about the real-time unit price, Data Code, Lead time, payment terms, and any other information you would like to know. We will do our best to provide you with a quotation and reply as soon as possible.
61082-102109 Specifications
- Part Number61082-102109
- CategoryRectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
- ManufacturerAmphenol ICC (FCI)
- DescriptionCONN RECEPT 100POS .8MM DUAL SMD
- Package-
- SeriesBergStak?, MezzSelect?
- FeaturesBoard Guide
- Mounting TypeSurface Mount
- Contact FinishGold
- Number of Positions100
- Pitch0.031" (0.80mm)
- Height Above Board0.303" (7.70mm)
- Connector TypeReceptacle, Outer Shroud Contacts
- Contact Finish Thickness3.9µin (0.10µm)
- Number of Rows2
- Mated Stacking Heights9mm, 10mm, 11mm, 12mm
Application of 61082-102109
61082-102109 Datasheet
61082-102109 Datasheet , BergStak?, MezzSelect?,Board Guide,Surface Mount,Gold,100,0.031" (0.80mm),0.303" (7.70mm),Receptacle, Outer Shroud Contacts,3.9µin (0.10µm),2,9mm, 10mm, 11mm, 12mm
61082-102109 Classification
Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
FAQ about Rectangular Connectors - Arrays, Edge Type, Mezzanine (Board to Board)
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1. Types of rectangular connectors?
1. In the past, it was mainly produced by enterprises under the Ministry of Electronics Industry, such as CA, CB, and CD rectangular connectors.
2. Now it is more commonly used, mainly produced by enterprises under the Ministry of Electronics.
3. J-type rectangular connectors, mainly produced by enterprises under the Ministry of Aviation and Aerospace.
4. Rectangular connectors produced according to the national military standard (GJB).
5. Rectangular connectors produced according to the International Electrotechnical Commission (IEC) standard.
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2. How to connect rectangular connectors?
1. Crimping: It has high mechanical strength, good electrical performance, and high reliability.
2. Welding: It has the advantage of simple operation. However, it is easy to form a cold solder joint that is not easy to find due to welding methods, operating space, etc.
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3. Common packaging methods for rectangular connectors?
1. Panel-mounted packaging
Panel-mounted packaging is the most common form of rectangular connector, which allows the connector to be directly fixed to the housing or panel of the device. This packaging method is usually achieved by screw locking, snap-on fixing or crimping to ensure a stable connection between the connector and the panel. The advantages of panel-mounted packaging are easy and quick installation, easy maintenance and replacement, and good mechanical strength and protection level. It is suitable for scenarios that require frequent plugging and unplugging or high protection requirements, such as industrial control equipment, communication equipment, medical equipment, etc.
2. PCB Mounting Package
PCB mounting packaging is another widely used rectangular connector packaging method. It directly solders the connector on the PCB (printed circuit board) and realizes electrical connection through pins or pads. This packaging method has the advantages of small size, light weight, flexible layout, etc., which can save space to the maximum extent and improve the integration of the circuit board. It is widely used in computers, consumer electronics, automotive electronics and other fields, especially in occasions with extremely high space requirements, such as mobile phones, tablets and other portable devices.
3. Pin header and socket combination packaging
The pin header and socket combination packaging is a packaging form in which the two parts of the connector (pin header and socket) are designed separately and then electrically connected by plugging. This packaging method is easy to plug and unplug and easy to replace and upgrade, and is particularly suitable for scenarios where frequent module replacement or system upgrade is required. For example, in the fields of test equipment, modular data centers, etc., the pin header and socket combination packaging can significantly improve the flexibility and maintainability of the system.
4. Mixed packaging
With the continuous development of electronic technology, a single packaging method has been difficult to meet the complex and changing application requirements. Therefore, mixed packaging came into being, which combines multiple packaging methods to form a comprehensive solution. For example, combining panel mounting with printed circuit board mounting not only ensures the stability of the connector, but also improves the integration of the circuit board; or combining the pin and socket combination with modular design to achieve a more flexible and changeable system configuration.
5. Special environmental adaptability packaging
In some special environments, such as high temperature, low temperature, high humidity, strong electromagnetic interference, etc., higher requirements are placed on the packaging method of rectangular connectors. To this end, a variety of special environmental adaptability packages have been developed, such as high temperature resistant packaging, waterproof packaging, anti-electromagnetic interference packaging, etc. These packaging methods improve the environmental adaptability of the connector by using special materials and optimizing structural design, ensuring that it can still work stably and reliably in harsh environments.
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