LPC2210FBD144/01,5

NXP USA Inc. LPC2210FBD144/01,5

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  • LPC2210FBD144/01,5
  • NXP USA Inc.
  • IC MCU 16/32BIT ROMLESS 144LQFP
  • Embedded - Microcontrollers
  • LPC2210FBD144/01,5 Datasheet
  • 144-LQFP
  • Tray
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 18755
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
LPC2210FBD144/01,5
Category
Embedded - Microcontrollers
Manufacturer
NXP USA Inc.
Description
IC MCU 16/32BIT ROMLESS 144LQFP
Package
Tray
Series
LPC2200
Operating Temperature
-40°C ~ 85°C (TA)
Mounting Type
Surface Mount
Package / Case
144-LQFP
Supplier Device Package
144-LQFP (20x20)
Voltage - Supply (Vcc/Vdd)
1.65V ~ 3.6V
Speed
60MHz
Number of I/O
76
EEPROM Size
-
Core Processor
ARM7®
RAM Size
16K x 8
Core Size
16/32-Bit
Connectivity
EBI/EMI, I²C, Microwire, SPI, SSI, SSP, UART/USART
Peripherals
POR, PWM, WDT
Program Memory Size
-
Program Memory Type
ROMless
Data Converters
A/D 8x10b
Oscillator Type
Internal
Package_case
144-LQFP

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NXP USA Inc.
NXP USA Inc.
NXP Semiconductors enables secure connections and infrastructure for a smarter world, advancing solutions that make lives easier, better and safer. As the world leader in secure connectivity solutions for embedded applications, NXP is ...
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