T1M-03-F-SH-L-K

Samtec Inc. T1M-03-F-SH-L-K

The picture is for reference only, please refer to the product specification

  • T1M-03-F-SH-L-K
  • Samtec Inc.
  • T1M 1MM TERMINAL STRIP
  • Rectangular Connectors - Headers, Male Pins
  • T1M-03-F-SH-L-K Datasheet
  • -
  • -
  • Lead free / RoHS CompliantLead free / RoHS Compliant
  • 17883
  • Spot Inventory / Athorized Dstributor / Factory Excess Stock
  • 1 year quality assurance 》
  • Click to get rates
Part Number
T1M-03-F-SH-L-K
Category
Rectangular Connectors - Headers, Male Pins
Manufacturer
Samtec Inc.
Description
T1M 1MM TERMINAL STRIP
Package
-
Series
T1M
Features
Pick and Place
Operating Temperature
-55°C ~ 85°C
Mounting Type
Surface Mount, Right Angle
Termination
Solder
Style
Board to Cable/Wire
Current Rating
3.3A per Contact
Contact Material
Phosphor Bronze
Number of Positions
3
Connector Type
Header
Number of Positions Loaded
All
Number of Rows
1
Insulation Color
Black
Contact Type
Male Pin
Fastening Type
Locking Ramp
Material Flammability Rating
UL94 V-0
Pitch - Mating
0.039" (1.00mm)
Shrouding
Shrouded - 4 Wall
Insulation Height
0.181" (4.60mm)
Contact Shape
Square
Contact Finish - Mating
Gold
Contact Finish - Post
Tin
Insulation Material
Liquid Crystal Polymer (LCP)
Contact Finish Thickness - Mating
3µin (0.08µm)
Package_case
-

T1M-03-F-SH-L-K Guarantees

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• Prompt Responsiveness

• Guaranteed Quality

• Global Access

• Competitive Market Price

• One-Stop support services of supply chain

Jinftry, Your most trustworthy component supplier, welcome to send us the inquiry, thank you!

Do you have any questions about T1M-03-F-SH-L-K ?
Feel free to contact us:

+86-755-82518276
+8615019224070, annies65, +8615118125813
568248857, 827259012, 316249462
+8615019224070, +8615118118839, +8615118125813
( Email first will be appreciative )

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Samtec Inc.
Samtec Inc.
Founded in 1976, Samtec is a privately held global manufacturer of a broad line of electronic interconnect solutions, including high-speed board-to-board, high-speed cables, mid-board and panel optics, microelectronics, flexible stacking, and micro/rugged components ...
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