CFRC303-G vs ES3B-M3/9AT
| Part Number |
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| Category | Diodes - Rectifiers - Single | Diodes - Rectifiers - Single |
| Manufacturer | Comchip Technology | Vishay Semiconductor - Diodes Division |
| Description | DIODE GEN PURP 200V 3A DO214AB | DIODE GEN PURP 100V 3A DO214AB |
| Package | Bulk | Tape & Reel (TR) |
| Series | - | - |
| Mounting Type | Surface Mount | Surface Mount |
| Package / Case | DO-214AB, SMC | DO-214AB, SMC |
| Supplier Device Package | DO-214AB (SMC) | DO-214AB (SMC) |
| Diode Type | Standard | Standard |
| Current - Average Rectified (Io) | 3A | 3A |
| Voltage - Forward (Vf) (Max) @ If | 1.3 V @ 3 A | 900 mV @ 3 A |
| Current - Reverse Leakage @ Vr | 5 µA @ 200 V | 10 µA @ 100 V |
| Capacitance @ Vr, F | - | 45pF @ 4V, 1MHz |
| Voltage - DC Reverse (Vr) (Max) | 200 V | 100 V |
| Speed | Fast Recovery =< 500ns, > 200mA (Io) | Fast Recovery =< 500ns, > 200mA (Io) |
| Reverse Recovery Time (trr) | 150 ns | 30 ns |
| Operating Temperature - Junction | 150°C (Max) | -55°C ~ 150°C |
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1. What are the common applications of a single rectifier diode?
They are commonly used in power circuits, chargers, AC to DC converters, motor drives, circuit protection, and other electronic devices to convert AC power to DC power or protect circuits from reverse current.
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2. What is the maximum reverse voltage (PIV) of a rectifier diode?
The Peak Inverse Voltage (PIV) is the maximum reverse voltage that a diode can withstand. When selecting a diode, the PIV must be higher than the maximum reverse voltage in the circuit, usually twice or more the input voltage.
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3. What is the reverse recovery time of a rectifier diode?
Reverse recovery time refers to the time required for a diode to transition from a forward conducting state to a reverse blocking state. A shorter reverse recovery time is particularly important in high-frequency applications to reduce power loss.
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4. What are the packaging types of rectifier diodes?
There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.
