CMDD4448 TR vs MBRD360T4G

Part Number
CMDD4448 TR
MBRD360T4G
Category Diodes - Rectifiers - Single Diodes - Rectifiers - Single
Manufacturer Central Semiconductor Corp ON Semiconductor
Description DIODE GEN PURP 75V 250MA SOD323 DIODE SCHOTTKY 60V 3A DPAK
Package SC-76, SOD-323 Cut Tape (CT)
Series - SWITCHMODE™
Mounting Type Surface Mount Surface Mount
Package / Case SC-76, SOD-323 TO-252-3, DPak (2 Leads + Tab), SC-63
Supplier Device Package SOD-323 DPAK
Diode Type Standard Schottky
Current - Average Rectified (Io) 250mA 3A
Voltage - Forward (Vf) (Max) @ If 1V @ 100mA 600 mV @ 3 A
Current - Reverse Leakage @ Vr 25nA @ 20V 200 µA @ 60 V
Capacitance @ Vr, F 4pF @ 0V, 1MHz -
Voltage - DC Reverse (Vr) (Max) 75V 60 V
Speed Fast Recovery =< 500ns, > 200mA (Io) Fast Recovery =< 500ns, > 200mA (Io)
Reverse Recovery Time (trr) 4ns -
Operating Temperature - Junction -65°C ~ 175°C -65°C ~ 150°C
  • 1. What is a single rectifier diode?

    A single rectifier diode is an electronic component used to convert alternating current (AC) to direct current (DC), typically used in power supplies, chargers, and other circuits that require DC power.

  • 2. What is the difference between a single rectifier diode and a bridge rectifier?

    A single rectifier diode can only rectify the positive half wave of AC power (half wave rectification), while a bridge rectifier composed of four diodes can rectify the positive and negative half waves of AC power (full wave rectification), with higher efficiency and smoother output.

  • 3. What is a fast recovery diode?

    Fast recovery diode is a special type of rectifier diode with a short reverse recovery time, suitable for high-frequency power supplies and switch mode power supplies (SMPS) applications, reducing switching losses.

  • 4. What are the packaging types of rectifier diodes?

    There are various packaging types for rectifier diodes, including axial pin packaging (such as DO-41), surface mount packaging (such as SMA, SMB), and high-power packaging (such as TO-220). When selecting, the appropriate packaging should be chosen based on the application's heat dissipation requirements and installation method.

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